Parts from MICRON TECHNOLOGY

JS28F128J3F75A

JS28F128J3F75AIC FLASH 128M PARALLEL 56TSOPROHS/PbFREETRAY

MT49H8M36FM-33IT

MT49H8M36FM-33ITIC DRAM 288MBIT PARALLEL 144UBGAINDUSTRIALREEL

MT35XU512ABA1G12-OSIT

MT35XU512ABA1G12-OSITNOR Memory IC 512Mbit SPI - Octal I/O 200 MHz 6 ns 24-T-PBGA (6x8)TRAY

MT28F002C1VG-8T

MT28F002C1VG-8TNOR Flash Parallel 5V 2M-bit 256K x 8 80ns 40-Pin TSOP-I TRAY OBSOLETE

MT48LC16M16A2-7ED

JS28F640J3D75

JS28F640J3D75 JS28F640J3D-75 JS28F640-J3D75 FLASH 64M PARALLEL 56TSOP

MT55L64L32F1T-12

MT55L64L32F1T-12 MICRON MT55L64L32F1T-12 IT SRAM Chip Sync Single 3.3V 2M-bit 64K x 32 9ns 100-Pin TQFP

MT55L64L32PT-10

MT48LC16M16A2BG-75:D

EDY4016AABG-DR-F-ES-D

EDY4016AABG-DR-F-ES-D DDR4 SDRAM 256MX16 PLASTIC FBGA 1.2V COMMERCIALECCN: 3A991.B.1.A

MT48LC8M16A2-75L

MT48LC2M32B2-70

MT25QU01GBBB8E12-0SIT

MT25QU01GBBB8E12-0SIT FLASH

MT40A512M16JY-083E:B

MT40A512M16JY-083E:BDRAM Chip DDR4 SDRAM 8Gbit 512Mx16 1.2V 96-Pin FBGA

MT41J1287M8JP-15E:F

MT41J1287M8JP-15E:FCUT TAPE

MT41K256M16TW-107:PD

MT41K256M16TW-107:PDMT41K256M16TW-107:PD/C:9D1290CUT TAPE

MT47H128M16RT-187E:C

MT47H128M16RT-187E:CDRAM Chip DDR2 SDRAM 2G-Bit 128Mx16 1.8V 84-Pin FBGA TRAY, ROHS, SGN

MT41K128M16JT-125XIT:K

MT41K128M16JT-125XIT KMT41K128M16JT-125 XIT:K MICRON128MX 16 DDR3 SDRAM PLASTIC IND ROHSMT41K128M16 - 16 Meg x 16 x 8 banksDDR3L Memory IC 2Gb 128M x 16 Parallel 800MHz 13.75ns 96-FBGA (8x14)The 1.35V DDR3L SDRAM device is a low-voltage version of the 1.5V DDR3 SDRAM device. VDD = VDDQ = 1.35V (1.283-1.45V) Backward-compatible to VDD = VDDQ = 1.5V±0.075V Differential bidirectional data strobe 8n-bit prefetch architecture Differential clock inputs (CK, CK#) 8 internal banks Nominal and dynamic on-die termination (ODT)for data, strobe, and mask signals Programmable CAS (READ) latency (CL) Programmable posted CAS additive latency (AL) Programmable CAS (WRITE) latency (CWL) Fixed burst length (BL) of 8 and burst chop (BC) of 4(via the mode register set [MRS]) Selectable BC4 or BL8 on-the-fly (OTF) Self refresh mode TC of 95°C- 64ms, 8192-cycle refresh up to 85°C- 32ms, 8192-cycle refresh at >85°C to 95°CSelf refresh temperature (SRT)

MT28F008B3VG10BD

MT58L64L36D-10A

MT58L64L36D-10A MICRON SRAM Chip Sync Quad 3.3V 2M-bit 64K x 36 5ns 165-Pin FBGA

MT46V16M16P-6TIT:K

MT46V16M16P-6T IT:K Micron Technology Inc. IC SDRAM 256MBIT 167MHZ 66TSOP. OBSOLETE. USA STOCK.

CT6464Z40B.16TG2

CT6464Z40B.16TG2 Crucial 512MB DDR 400 CL3 512MB PC3200 DDR-400MHz non-ECC Unbuffered CL NEW OEM BULK MADE IN MALAYSIA

MT48LC8M16A2B4-6A XIT:L

MT48LC8M16A2B4-6A XIT:LSDRAM Memory IC 128Mbit Parallel 167 MHz 5.4 ns 54-VFBGA (8x8)TRAY ROHSOBSOLETE

MT29C4G48MAZBBAKB-48 IT

MICRON TECHNOLOGY INC.MT29C4G48MAZBBAKB-48 IT(MT29C4G48MAZBBAKB-48IT)FBGA CODE JWC09MCP 256Mx16 Flash + 64Mx32 LPDDR SDRAM 1.8V 168-Pin WFBGA168 X TRAY, OBSOLETE MT29C4G48MAZBBAKB-48 IT is a specific part number that represents a memory module or integrated circuit. Here's some information about this particular part: Manufacturer: Micron Technology Model: MT29C4G48MAZBBAKB-48 Package Type: BGA (Ball Grid Array) Organization: 4G x 48 Interface: DDR4 SDRAM Speed Grade: -48 Temperature Grade: IT (Industrial Temperature) Micron Technology is a well-known manufacturer of memory products, including DRAM modules. The specific model, MT29C4G48MAZBBAKB-48, indicates that it is a DDR4 SDRAM module with a capacity of 4 gigabits (G) and an organization of 4G x 48, resulting in a total capacity of 4 gigabytes (GB). The package type for this module is BGA (Ball Grid Array), which means it has solder balls arranged in a grid pattern on the underside for surface mounting onto a printed circuit board. The speed grade -48 specifies the performance characteristics of the DDR4 SDRAM module, including the maximum operating frequency. Different speed grades within a DDR4 series offer varying levels of performance, with higher numbers indicating higher operating frequencies. The temperature grade IT (Industrial Temperature) indicates that the module is designed to operate within a wider temperature range than standard commercial-grade modules. Industrial-grade components are typically designed to withstand more extreme temperature conditions and are suitable for industrial applications where temperature variations are common.DOWNLOAD DATASHEET